MINIATURIZATION
MINIATURIZATION
WE REWROTE THE RULES FOR SWaP OPTIMIZATION
Benchmark uses a variety of strategies to help customers like you overcome size, weight, and power challenges. No matter which tools we use, the outcome is the same: a product optimized for how it will be used, not limited by the electronics it contains.
WE REWROTE THE RULES FOR SWaP OPTIMIZATION
Benchmark uses a variety of strategies to help customers like you overcome size, weight, and power challenges. No matter which tools we use, the outcome is the same: a product optimized for how it will be used, not limited by the electronics it contains.
Our electrical and mechanical engineers work to ensure the electronics fit within that form factor. We design for size and manufacturability, ensuring that the transition from design to manufacturing is seamless. Our complete lifecycle management services support your product even after manufacturing and innovation for the next version.
Our electrical and mechanical engineers work to ensure the electronics fit within that form factor. We design for size and manufacturability, ensuring that the transition from design to manufacturing is seamless. Our complete lifecycle management services support your product even after manufacturing and innovation for the next version.
Our engineering toolkit includes methods for reducing the size of electronics, allowing us to select the best approach to reach your miniaturization goals. We design High Density Interconnect circuits that utilize 3-dimensional space to achieve maximum functionality in smaller, lighter circuits.
Our engineering toolkit includes methods for reducing the size of electronics, allowing us to select the best approach to reach your miniaturization goals. We design High Density Interconnect circuits that utilize 3-dimensional space to achieve maximum functionality in smaller, lighter circuits.
Miniaturization Capabilities
- High Density Interconnect (HDI) circuit board design
- Integrated thermal management features for high-density designs, developed on the latest thermal modeling software
- Solutions for a wide range of RF frequencies without crosstalk
- Hybrid micro-e and SMT assemblies
- Design for optimal size, form, and manufacturing
Miniaturization Capabilities
- High Density Interconnect (HDI) circuit board design
- Integrated thermal management features for high-density designs, developed on the latest thermal modeling software
- Solutions for a wide range of RF frequencies without crosstalk
- Hybrid micro-e and SMT assemblies
- Design for optimal size, form, and manufacturing
Atomic Clock Case Study
Benchmark helped our partner manufacture a groundbreaking miniaturized design.
Atomic Clock Case Study
Benchmark helped our partner manufacture a groundbreaking miniaturized design.
Let’s Innovate Together
Let’s Innovate Together
